Thin plastic leadless package with exposed metal die paddle

ABSTRACT

A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.11/929,418, filed Oct. 30, 2007, which claims priority to MalaysiaApplication No. PI 20071214, filed Jul. 25, 2007, both of which areincorporated herein by reference in their entirety for all purposes.

BACKGROUND OF THE INVENTION

As electronic devices become smaller, the electronic packages that makeup the electronic devices have become smaller. As such, manufacturersare constantly searching for ways to make thinner packages. They oftentry to reduce the size or thickness of the packaging components. To thisend, manufacturers also may try to eliminate packaging components bymodifying and utilizing other components more efficiently. Currentlymanufacturers have developed package designs and correspondingmanufacturing methods, in which the package thickness has reached 0.3mm.

However, to produce smaller and thinner packages is challenging becausethere are components that are deemed to be essential for packaging andcannot be eliminated. In addition, to manufacture smaller packages thepackaging technology and process may need to be altered substantially,thereby adding to the manufacturing costs. As such, there is a need fora smaller and thinner package design and a method to manufacture thesame, especially to achieve a package thickness of 0.2 mm or less.

BRIEF SUMMARY OF THE INVENTION

Embodiments of the present invention provide systems and methods thatuse a leadframe as the main structure of the package so that theleadframe thickness is the thickness of the package. Embodiments of thepresent invention also provide methods of achieving a 0.2 mm thinplastic leadless package with an exposed metal die paddle (exposedheatsink).

In one embodiment of the present invention, a method of making packagesincludes providing a leadframe strip having a plurality of leadframes,wherein the leadframes have a plurality of leads, etching a surface ofeach of the leadframes to form an opening, wherein each of the leads hasa lead tip that connects to a die paddle within the opening, isolatingeach of the leads from the die paddle, adhering a tape to a bottom sideof the leadframe strips, leads, and die paddle, attaching a die to thedie paddle, placing ball bumps on each of the lead tips, and connectingthe die to the ball bumps.

In another embodiment of the present invention, molded ribs are formedon the leadframe strips.

In yet another embodiment of the present invention, the method includescreating a mold cap over the opening, thereby encapsulating the die.

In yet another embodiment of the present invention, the method includessingulating the leadframe strips.

In yet another embodiment of the present invention, the method includesapplying a layer of epoxy to a back side of the die, and placing theback side of the die on top of the die paddle.

In yet another embodiment of the present invention, the method ofconnection is done by wire-bonding.

In yet another embodiment of the present invention, the method furtherincludes coating the leadframe strip with NiPdAu.

In another embodiment of the present invention, an electronic packageincludes a leadframe having a plurality of leads, wherein each of theleads has a lead tip, an opening formed within the leadframe, a diepaddle that is disposed within the opening and is isolated from each ofthe lead tips, a tape that is adhered to a back side of the leadframe,leads, and die paddle, and a die, wherein the die is attached to the diepaddle and is connected by wires to a bump disposed on each of the leadtips.

In yet another embodiment of the present invention, the electronicpackage further includes a mold cover that encapsulates the opening.

In yet another embodiment of the present invention, the mold cover ofthe electronic package is selected from a group consisting of flushedmold cap, raised flat mold cap, and dome-shaped mold cap.

In yet another embodiment of the present invention, the opening of theelectronic package has a predetermined depth.

In yet another embodiment of the present invention, the die paddle ofthe electronic package has a thickness that is smaller than thepredetermined depth of the opening, and is configured to fit within theopening.

In yet another embodiment of the present invention, the die of theelectronic package has a thickness that is smaller than thepredetermined depth of the opening, and is configured to fit within theopening after attachment to the die paddle.

In yet another embodiment of the present invention, the lead tip of theelectronic package includes metal and a thickness that is less than0.025 mm.

In yet another embodiment of the present invention, the leadframeincludes a leadframe strip coated with NiPdAu.

In another embodiment of the present invention, a method of makingpackages includes providing a leadframe strip that includes a pluralityof leadframes, wherein the leadframes include a plurality of leads,etching a surface of each of the leadframes to form an opening, whereineach of the leads has a lead tip that connects to a die paddle withinthe opening, isolating each of the leads from the die paddle, removingthe die paddle, adhering a tape to a bottom side of the leadframe stripsand leads, and attaching a flip chip to each of the lead tips. Themethod can further include coating the leadframe strip with NiPdAu.

In yet another embodiment of the present invention, the method includesconnecting a plurality of metal bumps from the flip chip to each of thelead tips.

In yet another embodiment of the present invention, the method furtherincludes providing molded ribs to the leadframe strips.

In yet another embodiment of the present invention, the method includescreating a mold cap over the opening, thereby encapsulating the die.

In another embodiment of the present invention, an electronic packageincludes a leadframe having a plurality of leads, wherein each of theleads has a lead tip, an opening formed within the leadframe, a tapethat is adhered to a back side of the leadframe and leads, and a flipchip, wherein the flip chip includes a plurality of metal bumps and isconnected with each of the lead tips through the each of the metalbumps. The leadframe of the electronic package can also include aleadframe strip coated with NiPdAu.

In yet another embodiment of the present invention, the electronicpackage further includes a mold cover that encapsulates the opening.

In yet another embodiment of the present invention, the mold cover ofthe electronic package is selected from a group consisting of flushedmold cap, raised flat mold cap, and dome-shaped mold cap.

In yet another embodiment of the present invention, the opening of theelectronic package has a predetermined depth.

In yet another embodiment of the present invention, the flip chipconnected to the electronic package has a thickness that is smaller thanthe predetermined depth of the opening, and is configured to fit withinthe opening.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects, and advantages of the presentinvention will become better understood with regard to the followingdescription and the accompanying drawings, which illustrate examples ofthe invention.

FIG. 1 is an illustration of a raw leadframe copper blank strip.

FIG. 2 is an illustration of a leadframe strip.

FIG. 3 is a plan view individual leadframe pattern design is critical toachieve the desired result of a thin leadless package.

FIG. 4 is a three-dimensional view of a thin leadless package.

FIG. 5 is a cross section view of the individual leadframe illustratedin FIG. 4 after etching, in accordance with one embodiment of theinvention.

FIG. 6 is a plan view of the individual leadframe illustrated in FIG. 5before isolation, in accordance with one embodiment of the invention.

FIG. 7 is a plan view of the individual leadframe illustrated in FIG. 6after lead isolation, in accordance with one embodiment of theinvention.

FIG. 8 is a three-dimensional view of the individual leadframeillustrated in FIG. 7 after lead isolation, in accordance with oneembodiment of the invention.

FIG. 9 is a three-dimensional view of the individual leadframeillustrated in FIG. 8 after die paddle removal, in accordance with oneembodiment of the invention.

FIG. 10 is a bottom view of a leadframe strip that is taped withpolymide tape or equivalent, in accordance with one embodiment of theinvention.

FIG. 11 is a cross section view of individual leadframe after tapingwith lead isolation, in accordance with one embodiment of the invention.

FIG. 12 is a cross section view of individual leadframe after tapingwith lead isolation with the die paddle removed, in accordance with oneembodiment of the invention.

FIG. 13 is a plan view of leadframe strip with molded ribs, inaccordance with one embodiment of the invention.

FIG. 14 is a cross section view of individual leadframe with a chipattached, in accordance with one embodiment of the invention.

FIG. 15 is a cross section view of an individual leadframe with ballbumps on lead tips, in accordance with one embodiment of the invention.

FIG. 16 is a plan view of an individual leadframe with ball bumps onlead tips, in accordance with one embodiment of the invention.

FIG. 17 is a plan view of an individual leadframe with a chip that iswire connecting to the lead tips, in accordance with one embodiment ofthe invention.

FIG. 18 is a cross section view of an individual leadframe with a chipthat is wire connected to the lead tips, in accordance with oneembodiment of the invention.

FIG. 19 is a plan view of an individual leadframe with wires connectingthe chip to the lead tips, in accordance with one embodiment of theinvention.

FIG. 20 is a cross section view of individual leadframe after flip chip,in accordance with one embodiment of the invention.

FIG. 21 is a cross section view of an individual leadframe afterencapsulation, in accordance with one embodiment of the invention.

FIG. 22 is a three-dimensional view of an individual leadframe afterencapsulation, in accordance with one embodiment of the invention.

FIG. 23 is a cross section view of an individual leadframe with raisedflat mold cap, in accordance with one embodiment of the invention.

FIG. 24 is a three-dimensional view of an individual leadframe withraised flat mold cap, in accordance with one embodiment of theinvention.

FIG. 25 is a cross section view of an individual leadframe with a domeshape mold cap, in accordance with one embodiment of the invention.

FIG. 26 is a three-dimensional view of an individual leadframe with adome shape mold cap, in accordance with one embodiment of the invention.

FIG. 27 is a three-dimensional view of an individual leadframe lead cut,in accordance with one embodiment of the invention.

FIG. 28 is a three-dimensional view of an individual leadframesingulated, in accordance with one embodiment of the invention.

FIG. 29 is a top three-dimensional view of a singulated unit, inaccordance with one embodiment of the invention.

FIG. 30 is a bottom three-dimensional view of a singulated unit, inaccordance with one embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

In general the present invention provides a package design and a methodof manufacturing the same that provide a leadless package and reduce thethickness of the package. The embodiments of the present invention areimplemented in a manner that utilizes the existing leadframe basetechnology, in which manufacturing can be done more efficiently, whilealso providing an exposed heatsink through the exposed metal die paddle.Embodiments of the present invention are sufficiently flexible for usewith wire-bonded die and flip chips. As one of skill in the art willappreciate, the embodiments described herein are exemplary, and otherembodiments are possible. Like reference numerals refer to the same itemin different figures.

FIG. 1 is an illustration of a raw leadframe copper blank strip 10, witha given length 12, width 14, and thickness 16. The copper blank strip 10is the starting point in the manufacture of a leadframe (not shownhere). The length 12 and width 14 of the leadframe copper blank strip isflexible and is determined by production requirement. The thickness 16of the leadframe copper blank strip can be of any desired size, as thiswill determine the minimum thickness of the finished product, which isthe package. In a preferred embodiment, the thickness 16 is 0.2 mm.However, it should be appreciated that a thinner leadframe copper blankstrip can be used if a thinner package of less than 0.2 mm is required.

FIG. 2 is an illustration of a leadframe strip 20. The leadframe strip20 comprises multiple leadframes 22. Each leadframe 22 has a particularpattern, in which the individual leadframe pattern will be etched outfrom the raw leadframe copper blank strip 10 in a single etch step.Additionally the leadframes 22 can be arranged in a pattern thatmaximizes the number of leadframes 22 that fit into the leadframe 20 andthat can be processed with existing equipment. In one such arrangementthe leadframes are positioned in a matrix array. In the preferredembodiment, the leadframe copper blank strip 10 will be in a reel duringprocessing and upon completion the blank 10 will be cut to the requiredlength 12. In other embodiments the leadframes can be cut out of thecopper blanks during the reel processing.

FIG. 3 is a plan view of the individual leadframe 22 described in FIG.2. The individual leadframe pattern design is used to achieve thedesired result of a thin leadless package. The leadframe 22 is made of aplurality of individual leads 32. The number of individual leads 32 canvary depending on the application.

FIG. 4 is a three-dimensional view of a thin leadless package that hasbeen etched to have a recessed region to position a die. By etching theleadframe 22, the resulting pattern will provide a metal die paddle 42,in which the die paddle 42 serves as a platform for attaching the chip,or die (not shown). The recessed region or die paddle can be formed byvarious application such dry etching or wet etching. In this embodiment,the metal die paddle 42 is joined to the individual leads 32. The metaldie paddle 42 provides a heat sink since it is exposed and facilitateswire connection (e.g., gold or copper) from the chip to the leads 32,which are also exposed metal pads. For flip chip connection, the chip(die) will connect directly to the leads 32 thru metal bumps (notshown).

FIG. 5 is a cross-sectional view of the individual leadframe 22illustrated in FIG. 4 after etching, in accordance with one embodimentof the invention. In the preferred embodiment, the area of theindividual leadframe 22 that makes up the metal die paddle 42 and theindividual leads 32 is etched so that a metal thickness less than 25microns remains after etching. At this stage, the leadframe strip 20 isalso plated with NiPdAu or equivalent material to prepare the areasmaking up the metal die paddle 42 and the individual leads 32 for theeventual chip connection. In one embodiment the individual leadframe 22is etched so that the round corner is formed between the die paddle 42and the individual lead 32, as illustrated. In another embodiment asharp inside edge is formed between the die paddle and the individuallead 32 (not shown). The view along A-A′ is illustrated in FIG. 6.

FIGS. 6-13 illustrate leadframe preparation prior to assembly.

FIG. 6 is a plan view of the individual leadframe 22 illustrated in FIG.5 before isolation, in accordance with one embodiment of the invention.At this point, the leadframe 22 has been etched and plated as describedabove. The cross section of this plan view is illustrated in FIG. 5 andthe view along line A-A′ is depicted.

FIG. 7 is a plan view of the individual leadframe 22 illustrated in FIG.6 after lead isolation, in accordance with one embodiment of theinvention. A tool is used to isolate the leads 32 from the die paddle 42or to remove the die paddle 42 completely for flip chip attachment. Thetool mechanically punches out the metal between the leads 32 and the diepaddle 42. The tool is also used to define the exposed lead length andthe exposed die paddle 42 of the package.

Although the operations illustrated in FIGS. 1-7 can be performed aspart of the lead frame packaging process, these operations can also beperformed by a leadframe supplier so that leadframes with the describedshape are sent to the packaging operations prepared for subsequent chipassembly.

FIG. 8 is a three-dimensional view of the individual leadframeillustrated in FIG. 7 after lead isolation, in accordance with oneembodiment of the invention.

FIG. 9 is a three-dimensional view of the individual leadframeillustrated in FIG. 8 after die paddle removal, in accordance with oneembodiment of the present invention.

FIG. 10 is a bottom view of the leadframe strip 20 after the leadisolation. In this embodiment of the present invention, the bottom ofthe leadframe strip 20 is taped with polymide tape 102, or equivalenttype of material, where the exposed leads 32 (metal pad) and exposed diepaddle 42. FIGS. 11-12 illustrate further details of the polymide tape102 attached to the leadframe strip 20.

FIG. 11 is a cross-sectional view of individual leadframe 22 after leadisolation and taping, in accordance with an embodiment of the presentinvention. In one embodiment of the invention, a tape 102 is attached tothe bottom of the leadframe 22 before the die paddle 42 is removed. Thetape 102 can be used to support the leads from being damaged insubsequent processes. Supporting the leads with tape 102 can beadvantages in applications where the leads are flimsy after they havebeen isolated in the lead isolation process.

FIG. 12 is a cross section view of individual leadframe 22 after leadisolation and taping with the die paddle removed, in accordance with anembodiment of the present invention. In this embodiment, the die paddle42 is first removed from the leadframe 22 and then the tape 102 isapplied to the bottom of the leadframe 22. As with the embodimentillustrated in FIG. 11, the tape 102 can be used to support the leadsfrom being damaged in subsequent processes. As described above withreference to FIG. 11, supporting the leads with tape 102 can beadvantages in applications where the leads are flimsy after they havebeen isolated in the lead isolation process.

FIG. 13 is a plan view of leadframe strip 20, in accordance with anotherembodiment of the present invention. The leadframe strip 20 has moldedribs 132 along the sides to add rigidity to its overall structure. Thisstep of adding molded ribs is optional, depending on the leadframe striprigidity requirements. This step would involve molding plastic ribs onstrategic locations on the leadframe strip.

FIGS. 14-29 illustrate the assembly of the leadframe.

FIG. 14 is a cross-sectional view of individual leadframe 22 with a chip142 attached, in accordance with an embodiment of the present invention.A layer of conductive epoxy 144 (or like adhesive material) is appliedto the backside of the chip (or die) 142 to affix it 142 to the diepaddle 42. The epoxy 144 can be in the form of a film or can be screenprinted onto the die paddle 42, so that the epoxy bond line thicknesscan be better controlled, thereby controlling the overall height of thepackage. The chip (die) 142 is then picked and placed onto the diepaddle of the individual leadframe using die bonder equipment. Thisarrangement is to set up electrical connection between the chip 142 andlead tips 146 of the individual leads, and this arrangement will befurther described in connection with FIG. 18.

In one embodiment, the present invention can be used to manufacture apackage that has a thickness of 0.2 mm or less. To meet thisrequirement, the chip (die) needs to be processed to a maximum thicknessof 0.050 mm.

FIG. 15 is a cross-sectional view of an individual leadframe 22 withball bumps 152 on lead tips 146, in accordance with another embodimentof the invention. The addition of ball bumps 152 to the lead tips 146depends on the flatness of the lead tip surface for wire bonding. Inother words, the addition of the ball bumps 152 is optional. Ball bumps152 are placed on the lead tips 146 using wire bonding machine toprovide a flat surface for subsequent wire connection between the chip142 and the leads 32. Ball bumps 152 can be made of different materialssuch as gold or copper.

FIG. 16 is a plan view of an individual leadframe 22 with ball bumps 152on lead tips 146 located on individual leads 32, in accordance with oneembodiment of the present invention.

FIG. 17 is a plan view of an individual leadframe 22 with a chip 142that is wire-connected to the lead tips 146, in accordance with anotherembodiment of the invention. The wire 172 is used to facilitateelectrical connection between the chip 142 and the lead tips 146. Thewire 172 is connected via the wire-bonding process. Depending on theapplication, the wire is preferably gold and can also be aluminum.Either a ball or a stitch is placed on the ball bump during thewire-bonding process depending on the mode of bonding to achieve aminimum loop height. In this embodiment, one end of the wire 172 isconnected to the chip 142 through a ball bump while the other end of thewire is connected to the lead tips 146 through a stitch bond 182 placedon each of the ball bumps 152 during the wire-bonding process.

FIG. 18 is a cross-sectional view of an individual leadframe 22 with achip 142 that is wire-connected to the lead tips 146 through the ballbumps 152, in accordance with an embodiment of the present invention. Aswith the embodiment illustrated in FIG. 17, the wire 172 is used tofacilitate electrical connection between the chip 142 and the lead tips146, and it 172 is connected via the wire-bonding process. Depending onthe application, the wire is preferably gold or copper and can also bealuminum. Either a ball or a stitch is placed on the ball bump duringthe wire-bonding process depending on the mode of bonding to achieve aminimum loop height. FIG. 18 shows an embodiment in which an additionalball bump 152A is placed on the chip and a ball 174 is used and placedon each of the ball bumps 152 while the other end of the wire isconnected to the chip through a stitch bond 182 placed on each ball bump152A during wire-bonding. FIGS. 18, 21, 23, and 25 illustrate additionalembodiments that include ball bump 152A and stitch bond 182.

FIG. 19 is a plan view of an individual leadframe 22 with wires 172connecting the chip 142 to the lead tips 146, in accordance with oneembodiment of the present invention.

The wires 172 are connected via wire bonding to the ball bumps 152 onlead tips 146 of the individual leads 32 as described above withreference to FIGS. 17 and 18.

FIG. 20 is a cross-sectional view of an individual leadframe 22 afterflip chip attachment, in accordance with another embodiment of theinvention. When attaching a flip chip 192, it preferably uses aleadframe 22 with the die paddle 42 removed, as described in connectionwith FIGS. 9 and 12. The flip chip 192 is bonded to the lead tips 146through its metal bumps 194 with the use of a flip chip bonder. Themetal bump, which can be gold or copper, can be applied by thermo-sonicbonding or reflow with solder paste.

FIG. 21 is a cross-sectional view of an individual leadframe 22 afterencapsulation, in accordance with yet another embodiment of the presentinvention. The chip (die) 142 and wires 172 are then protected from theenvironment by encapsulating the chip 142 and the wires 172 with aliquid mold compound. (In an alternative embodiment, the flip chip 192and its metal bumps 194 can be encapsulated with the same type of liquidmold compound for environmental protection.) A black or clear liquidmold compound can be used depending on the application. For example, aclear liquid mold compound will be used for an optical application.After the liquid mold compound dries and solidifies, it becomes a moldcap 202. FIG. 21 shows the mold cap 202 that is flushed with the top 204of the leadframe 22. This embodiment is best suited for manufacturingthe thinnest possible package, such as one that has a thickness of 0.2mm or less. It should be appreciated that the mold cap 202 can be indifferent thicknesses and configuration as will be described in FIGS.23-26.

FIG. 22 is a three-dimensional view of an individual leadframe 22 afterencapsulation, in accordance with an embodiment of the presentinvention.

FIG. 23 is a cross-sectional view of an individual leadframe 22 with araised flat mold cap 222, in accordance with one embodiment of thepresent invention. The raised flat mold cap 222 is raised over the topof the leadframe 22. The raised flat mold cap 222 is suitable to createpackages that are thicker, such as one that has a thickness greater than0.2 mm. For example, this embodiment may be useful when the chip (die)142 is thicker. This embodiment provides some flexibility inapplications where the chip (die) 142 thickness is more than 0.050 mmbut less than 0.100 mm. In these applications the mold cap can be raisedby 0.050 mm.

FIG. 24 is a three-dimensional view of an individual leadframe 22 withraised flat mold cap 222, in accordance with an embodiment of thepresent invention.

FIG. 25 is a cross-sectional view of an individual leadframe 22 with adome-shaped mold cap 242, in accordance with another embodiment of thepresent invention. The dome-shaped mold cap 242 also is raised over thetop of the leadframe 22. The dome-shaped mold cap 242 is suitable tocreate packages that are thicker, such as one that has a thicknessgreater than 0.2 mm. The dome-shaped mold cap 242 is also more suitablefor packages with optical applications.

FIG. 26 is a three-dimensional view of an individual leadframe 22 with adome-shaped mold cap 242, in accordance with an embodiment of thepresent invention.

FIG. 27 is a three-dimensional view of an individual leadframe 22 leadcut, in accordance with one embodiment of the present invention. Afterencapsulation, the leadframe strip 20 is then singulated, causing theindividual leadframes 22 to separate physically from each other. One ofskill in the art will recognize the appropriate specialized tools tosingulate the leadframe strip 20. FIG. 27 specifically shows the use ofa lead cut punch 262 along each of the sides of the leadframe 22.

FIG. 28 is a three-dimensional view of an individual leadframe 22singulated, in accordance with another embodiment of the presentinvention. In this embodiment, FIG. 28 specifically shows the use of asingulation punch 272 along each of the sides of the leadframe 22.

Singulation of an individual molded package includes 2 steps. Firstly, asingulation punch 262 (FIG. 27) along each of the sides of the leadframe22 is carried out to separate the leads from the leadframe. Next, asingulation punch 272 (FIG. 28) along each of the corners of theleadframe is carried out to separate the tie bars from the leadframe.

FIG. 29 is a top three-dimensional view of a singulated leadframe unit282, in accordance with one embodiment of the present invention.

FIG. 30 is a bottom three-dimensional view of a singulated leadframeunit 292, in accordance with one embodiment of the present invention.

Although not illustrated, the electronic packages can be configured suchthat the top side of the electronic package can be mounted onto aprinted circuit board (PCB) with the bottom side of the package facingupwards with the exposed metal die paddle facing away from the PCBsurface. An additional heatsink can also be attached to the metal diepaddle for enhanced heat dissipation. Additionally the electronicpackages can be stacked one on top of the other depending on therequired application. In this embodiment, instead of stacking two ormore chips within one package for additional functionality, two or morepackages are staked on top of each other, where each package can haveone chip with specific functionality.

It will also be recognized by those skilled in the art that, while theinvention has been described above in terms of preferred embodiments, itis not limited thereto. Various features and aspects of theabove-described invention may be used individually or jointly. Further,although the invention has been described in the context of itsimplementation in a particular environment and for particularapplications, those skilled in the art will recognize that itsusefulness is not limited thereto and that the present invention can beutilized in any number of environments and implementations.

1.-7. (canceled)
 8. An electronic package comprising: a leadframe havinga plurality of leads, wherein each of the leads has a lead tip; a diepaddle that is isolated from each of the lead tips, wherein the diepaddle comprises a plurality of protrusions each corresponding to one ofthe leads; a recessed region extending over an entire surface of the diepaddle and each of the lead tips, each of the leads having a portionoutside the recessed region that is thicker than the lead tip, atransition between the thicker portion and the lead tip forming arounded corner on each of the leads; a tape that is adhered to a backside of the leadframe, the leads, and the die paddle; and a die, whereinthe die is attached to a front side of the die paddle and is connectedby wires to a bump disposed on each of the lead tips.
 9. The electronicpackage of claim 8 further comprising a mold cover that encapsulates therecessed region.
 10. The electronic package of claim 9, wherein the moldcover is selected from a group consisting of flushed mold cap, raisedflat mold cap, and dome-shaped mold cap.
 11. The electronic package ofclaim 8, wherein the recessed region has a predetermined depth.
 12. Theelectronic package of claim 8, wherein the die paddle: has a thicknessthat is smaller than a depth of the recessed region; and is configuredto fit within the recessed region.
 13. The electronic package of claim8, wherein the die: has a thickness that is smaller than a depth of therecessed region; and is configured to fit within the recessed regionafter attachment to the die paddle.
 14. The electronic package of claim8, wherein each of the lead tips comprises metal of a thickness that isless than 0.025 mm.
 15. The electronic package of claim 8 wherein theleadframe comprises a leadframe strip coated with NiPdAu.
 16. Theelectronic package of claim 8 configured to be mounted onto a printedcircuit board (PCB) with the bottom side of the electronic packagefacing upwards.
 17. A method of making packages comprising: providing aleadframe strip that includes a plurality of leadframes, each of theleadframes having a plurality of leads surrounding a die paddle; etchinga surface of each of the leadframes to form a recessed region extendingover an entire surface of the die paddle and over a portion of each ofthe leads closest to the die paddle, wherein each of the leads of eachleadframe has a lead tip that is connected to the die paddle within theopening during the etching; thereafter plating the leadframe strip toprepare the leads of each leadframe for die connection; thereafterisolating each of the lead tips from the die paddle of each leadframe;removing the die paddle of each leadframe; adhering a tape to a bottomside of the leadframe strip including the leads of each leadframe; andwithin each leadframe, attaching a flip chip to each of the lead tips.18. The method of claim 17, wherein the leadframe strip is plated withNiPdAu.
 19. The method of claim 17, wherein attaching the flip chipcomprises connecting a plurality of metal bumps from the flip chip toeach of the lead tips of a corresponding leadframe.
 20. The method ofclaim 17 further comprising providing molded ribs to the leadframestrip.
 21. The method of claim 17 comprising creating a mold cap overthe recessed region of each leadframe, thereby encapsulating the die.22. An electronic package comprising: a leadframe having a plurality ofleads, wherein each of the leads has a lead tip; an opening formedwithin the leadframe; a tape that is adhered to a back side of theleadframe and leads; and a flip chip, wherein the flip chip comprises aplurality of metal bumps and is connected with each of the lead tipsthrough the each of the metal bumps.
 23. The electronic package of claim22 further comprises a mold cover that encapsulates the opening.
 24. Theelectronic package of claim 22, wherein the mold cover is selected froma group consisting of flushed mold cap, raised flat mold cap, anddome-shaped mold cap.
 25. The electronic package of claim 22, whereinthe opening has a predetermined depth.
 26. The electronic package ofclaim 22, wherein the flip chip: has a thickness that is smaller thanthe predetermined depth of the opening; and is configured to fit withinthe opening.
 27. The electronic package of claim 22, wherein theleadframe comprises a leadframe strip coated with NiPdAu.